Wire bonder tpt wire bonder hb10.

  1. Electronics Research Institute
  2. Microelectronics department

Device information

  • Name: Wire bonder tpt wire bonder hb10.
    Model: ***
    Num of units: 1
  • Manufacture Year:
    Manufacturer Website:
  • Description: Attach Micro-chips to a pack through wire bonding - Ultrasound-cold wire welding
  • Availability: available
  • Services
    Cost
    -
    -

For more info and reservation contact:

  • Lab Person
  • Dr.Marwa Mansour
  • 01008089280
  • University Coordinator
  • Electronics Research Institute
  • info@eri.sci.eg
  • 00226252700