Description: 1. A universally applicable electroplating machine for the deposition of metals. 2. The production of plated-through-hole printed circuit boards for prototype and small batch production. The HitecPlate 3040 is designed for direct metallization and have baths for process steps cleaning, rinsing, pre-dipping, activating, rinsing, intensifying, rinsing, copper deposition.

Availability: available