Description: Thermal evaporation technique can be applied to deposit metallic contact layers for thin film devices such as OLEDs, solar cells and thin-film transistors. In addition, this technique can be used to deposit thick indium layers for wafer bonding. Sputtering technique is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. Thin antireflection coatings on glass for optical applications are also deposited by sputtering

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