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Device Information
Device Name
DC Pulsed Magnetron Sputtering
Model
0
Units Available
1
Manufacture Year
2015
Manufacturer Website
Description
A DC Pulsed Magnetron Sputtering System is used for thin film deposition on substrates using physical vapor deposition (PVD). The system employs a pulsed DC power supply applied to a magnetron target, producing a plasma that ejects material from the target onto a substrate. Pulsing the DC current allows deposition of insulating or compound materials while reducing arcing and improving film uniformity. The system includes: Vacuum chamber (high vacuum, low 10⁻⁶ Torr range) Magnetron sputtering guns (targets of metals, oxides, nitrides) Pulsed DC power supply (tunable frequency & duty cycle) Substrate holder (heating, rotation) Gas inlet & flow control (Ar, N₂, O₂) Control software for process parameters Applications: semiconductors, optics, protective coatings, MEMS devices, solar cells, decorative coatings.
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Additional Information
Can deposit metals, oxides, nitrides, and compounds. Pulsed DC allows deposition of insulating materials with reduced arcing. Often used in research labs and R&D for thin films and coatings. Compatible with substrate heating, rotation, biasing, and reacti